Strength analysis of solder joints used in microelectronics packaging
نویسندگان
چکیده
منابع مشابه
Mechanical degradation of microelectronics solder joints under current stressing
Understanding the mechanical degradation of microelectronic solder joints under high electric current stressing is an important step to develop a damage mechanics model in order to predict the reliability of a solder joint under such loading. In this paper, the experiment results for flip chip solder joints under high current stressing are reported. Nanoindentation tests suggest that mechanical...
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ژورنال
عنوان ژورنال: Eksploatacja i Niezawodnosc - Maintenance and Reliability
سال: 2020
ISSN: 1507-2711
DOI: 10.17531/ein.2020.2.12